In Japan thermal management simulations of electronic devices has large literature and it is a standard part of electronics design. The problem here is that we are trying to pack more performance into less space which leads to increased temperature of components. When cooling of such a device is not designed properly parts tend to melt down. Apart from mobile phone, projector, industrial pc and heatsink design the number of possible applications is close to infinite.
2013.06.13 - Flow Computing Techologies Ltd.